AGC’s Electronics Solutions

01/Technology Overview｜Carrier Glass Temporary Bonding Solutions

AGC’s Carrier Glass Technology temporarily bonds Ultra-Thin Glass to rigid carrier glass using a specialized bonding layer. The laminated structure improves the stability of delicate substrates that may otherwise crack, warp, or deform during transfer and processing.

By providing rigidity and dimensional stability, the carrier glass enables Ultra-Thin Glass and thin or flexible devices to be processed using existing manufacturing equipment. It also helps stabilize device fabrication processes such as deposition, patterning, coating, and heat treatment.

After device formation, customers can mechanically separate the processed substrate from the carrier glass through a mechanical lift-off (MLO) process. The bonding layer is designed to enable separation with a relatively low debonding force, helping reduce the risk of damage to thin or flexible devices.

The process can be summarized as follows:

1. AGC Production: AGC bonds Ultra-Thin Glass to carrier glass using a specialized bonding layer.
2. Customer Integration: The customer receives the laminated substrate and introduces it into the manufacturing process.
3. Device Fabrication: Devices are formed on the supported substrate through processes such as deposition, patterning, coating, or heat treatment.
4. MLO Process: The processed substrate is mechanically separated from the carrier glass with a relatively low debonding force.

AGC’s Carrier Glass Technology helps manufacturers process Ultra-Thin Glass and thin or flexible devices more reliably while reducing the risk of cracking, warping, and deformation.

Discuss Your Process Requirements

1. Stable Handling of Ultra-Thin Glass and Thin or Flexible Devices

Ultra-Thin Glass and thin or flexible devices can be difficult to transfer and process because they are susceptible to cracking, warping, bending, and deformation.

By temporarily bonding the Ultra-Thin Glass to a thicker and more rigid carrier glass, AGC’s technology improves the substrate's mechanical stability and makes it easier to handle throughout the manufacturing process. The laminated substrate can be transferred and processed using existing equipment, reducing the need for specialized handling systems.

The carrier glass also helps maintain the flatness of Ultra-Thin Glass and thin or flexible devices during processes such as deposition and patterning, supporting more stable fabrication.

2. Mechanical Lift-Off

What Is Mechanical Lift-Off?

Mechanical lift-off, or MLO, is a debonding process that customers use to mechanically separate the processed substrate from the carrier glass.

After device formation, mechanical force is applied to separate the thin or flexible devices from the carrier. AGC’s bonding layer is designed to enable separation with a relatively low debonding force, helping reduce the risk of damage to the devices.

Comparison with Laser Lift-Off

Laser lift-off, or LLO, uses laser energy to separate a substrate from its carrier. This method may require dedicated laser equipment and can increase initial investment and operating costs.

Depending on the substrate and device structure, laser exposure may also affect the Ultra-Thin Glass and thin or flexible devices. In contrast, MLO does not require laser irradiation or large-scale laser equipment.

Advantages of Low-Force MLO

One of the main challenges in mechanical debonding is controlling the force required to separate the substrate. Excessive force may cause cracking or deformation of Ultra-Thin Glass or damage to devices formed on it.

AGC’s bonding layer is designed to enable separation with a relatively low force. This helps preserve the integrity of delicate substrates and devices while simplifying the debonding process at the customer site.

3. High Heat Resistance of the Bonding Layer

AGC’s specialized bonding layer can withstand process temperatures of up to approximately 400°C.

This heat resistance allows laminated Ultra-Thin Glass to pass through high-temperature manufacturing processes such as deposition, coating, annealing, and other thermal treatments. It also helps prevent premature delamination or degradation of the bonding layer during processing.

As a result, manufacturers can maintain substrate stability through both handling and high-temperature device fabrication processes.

4. Available in Large Sizes

AGC can provide carrier glass solutions in sizes up to 920 × 730 mm. Larger sizes may also be discussed depending on the required specifications.

This approach can support improved process efficiency by enabling multiple devices to be formed on a single large substrate.

Because MLO does not require laser equipment, the technology can also simplify debonding when manufacturers scale processes to larger panel sizes.

5. ITO-Coated Ultra-Thin Glass Laminates (Optional)

AGC can optionally provide laminated Ultra-Thin Glass with an indium tin oxide (ITO) coating.

ITO deposition and the handling of ITO-coated Ultra-Thin Glass can be challenging because of the substrate’s limited rigidity. Temporarily bonding the Ultra-Thin Glass to carrier glass improves handling stability during coating and subsequent manufacturing processes.

The heat-resistant bonding layer also enables ITO deposition to be performed while the Ultra-Thin Glass remains laminated to the carrier glass.

Discuss Your Process Requirements

02/Potential Applications

AGC’s Carrier Glass Technology can temporarily support Ultra-Thin Glass and thin or flexible devices during manufacturing. It helps stabilize handling, transfer, and device fabrication processes across a wide range of thin or flexible applications.

Contact Us About Your Application

03/Specifications and Customization

AGC provides Carrier Glass Technology tailored to the substrate, manufacturing process, and device requirements. The following specifications are provided as general guidelines. Available conditions may vary depending on the substrate material, size, process temperature, bonding requirements, and debonding conditions.

Item	Available Range/Support
Target Substrates	Ultra-Thin Glass and other thin or flexible substrates, subject to evaluation
Minimum Glass Thickness	Down to 0.05 mm for Ultra-Thin Glass
Carrier Glass Thickness	Approximately 0.3–1.0 mm
Maximum Standard Size	Up to 920 × 730 mm
Available Process Temperature	Up to approximately 400°C
Prototyping	Small-scale trials and sample production available
Optional Processing	ITO coating and other specifications available upon consultation

Bonding conditions and carrier glass specifications can be customized according to the substrate characteristics and manufacturing process. Please contact AGC with information about your substrate material, thickness, size, process conditions, and debonding requirements.

Discuss Your Specifications with AGC

04/FAQs

What information is required to evaluate feasibility?

To evaluate feasibility, AGC typically requires information about the substrate material, thickness, size, manufacturing process, maximum process temperature, bonding conditions, and desired debonding method. Information about the device structure and any restrictions on mechanical force is also helpful.

Can AGC provide samples or support trial production?

Yes. AGC can provide samples and support small-scale trials to evaluate handling, process compatibility, and debonding performance before full-scale production. The available sample specifications and evaluation conditions depend on the substrate and intended process.

Can the bonding conditions be customized for different substrates and processes?

Yes. Bonding conditions can be adjusted according to the substrate material, thickness, size, process temperature, and required debonding force. AGC evaluates each application and proposes suitable specifications based on the customer’s manufacturing requirements.

How is compatibility with the customer’s manufacturing process evaluated?

Compatibility is evaluated based on the substrate properties and process conditions provided by the customer. Depending on the application, AGC may recommend sample testing or trial production to confirm handling stability, heat resistance, process compatibility, and debonding performance.

How does MLO affect the substrate or devices formed on it?

The bonding layer is designed to allow the customer to mechanically separate the substrate from the carrier glass with a relatively low debonding force. This helps reduce the risk of cracking, deformation, or damage to the devices formed on the substrate. Customers should evaluate actual performance under the customer’s process conditions.

What is the typical lead time for samples and trial production?

Lead times vary depending on the substrate specifications, size, processing requirements, and evaluation conditions. Please contact AGC with the relevant technical information to confirm the expected schedule.

Does AGC offer other carrier glass technologies?

We offer carrier glass technology for semiconductor packaging. If you are interested, please click the link below.

Other AGC's Carrier Glass Technology

Glass substrate for semiconductor packaging

Unlike AGC's Carrier Glass Technology with Bonding Layer, which focuses on handling delicate ultra-thin glass, this product emphasizes high flatness and smoothness, critical for the precision of semiconductor packaging. Supporting various wafer sizes (such as φ300 mm) and panel sizes, AGC’s glass substrates ensure reliable performance in processes requiring high-quality carrier glass, including those with special features like notches, serial numbering, and ID marking.